Liquid immersion type exposure apparatus

ABSTRACT

Disclosed is an exposure apparatus which includes a projection optical system for projecting a pattern of a reticle onto a substrate, wherein the substrate is exposed through a liquid medium kept at least in a portion between the substrate and an optical element of the projection optical system which optical element is nearest to the substrate, a supplying system for supplying a liquid medium, a collecting system for collecting a liquid medium, and an exhausting system for removing a bubble in the liquid medium through a bubble removing material having such property that it passes a gas but it does not pass a liquid.

CROSS-REFERNCE TO RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.10/931,572 filed on Sep. 1, 2004.

FIELD OF THE INVENTION AND RELATED ART

This invention relates to an exposure apparatus to be used in alithographic process for manufacture of devices such as semiconductorintegrated circuit, image pickup device (CCD), liquid crystal displaydevice or thin film magnetic head, for example. More particularly, theinvention concerns a liquid immersion type exposure apparatus in which asubstrate is exposed through a liquid medium supplied into at least aportion between a projection optical system and the substrate.

In liquid immersion type exposure apparatuses, a liquid medium isinterposed between a substrate to be exposed and one of opticalelements, constituting a projection optical system, which one is nearestto the substrate. Since the numerical aperture (NA) can be increasedthereby, attainment of higher resolution is expected. In relation tosuch liquid immersion type exposure apparatus, a method in which asubstrate to be exposed as a whole is immersed in a liquid, and a methodin which a liquid is interposed only between a substrate to be exposedand an optical element nearest to the substrate have been proposed (forexample, Japanese Laid-Open Patent Application, Publication No. 6-124873and PCT International Publication WO99/49504).

“Extreme-NA Water Immersion Lithography for 35-65 nm Technology”, byBruce Smith et al (Rochester Institute of Technology), in InternationalSymposium on 157 nm Lithography, 3-6, Sep. 2002, at Belgium, discussesimmersion liquid supplying and collecting methods for liquid immersiontype exposure apparatus.

FIG. 7 illustrates an example. In FIG. 7, denoted at 110 is a liquidsupplying nozzle for supplying a liquid medium, and denoted at 111 is aliquid collecting nozzle for collecting the liquid. Denoted at 115 is anair curtain for preventing the liquid medium from leaking outwardly.

The liquid supplying nozzle 110 is mounted in the vicinity of the edgeportion of a final lens 106 of a projection optical system, and itsupplies a liquid medium 107 toward the opposed surfaces of a substrate101 and the final lens 106 of the projection optical system. The liquidcollecting nozzle 111 is mounted on a side of the final lens 106, remotefrom the liquid supplying nozzle, collects the liquid medium.Additionally, there is an air curtain 115 outwardly of these nozzles,which curtain is produced by blowing a compressed air, such that theliquid medium between the substrate 101 and the final lens 106 is heldthere.

Although any air curtain is not used, aforementioned PCT InternationalPublication WO99/49504 shows a similar structure as of FIG. 7 inrelation to a liquid supplying nozzle and liquid collecting nozzle. PCTWO99/49504 further discloses adjusting the supplying rate and collectingrate of liquid medium 107 in accordance with the movement speed of thesubstrate 101.

In the structure shown in FIG. 7, adjustment of the air curtain providedby compressed airs is difficult to achieve, and there is a possibilitythat airs are mixed into the liquid medium. Furthermore, due to the flowof liquid following the stepwise motion or scan motion of the substratestage, the meniscus produced at the boundary between the liquid and theoutside ambience is easily broken, and since in that occasion themeniscus produced at the boundary of the liquid is close to the finallens 106, bubbles are easily mixed into the liquid between the substrate101 and the final optical lens 106. Once bubbles are mixed into theliquid medium, it disturbs the exposure and thus the exposure transferprecision is degraded thereby. This leads to a decrease of yield ofsemiconductor device production.

There is an additional problem that, since it is difficult to hold aconstant pressure applied to the liquid by the air curtain, a change inthe pressure inside the liquid medium causes a change of liquid density.As a result, the refractive index thereof easily varies to causevariation of the numerical aperture (NA) of the optical system. Thisresults in degradation of the exposure transfer precision and, thus, adecrease of yield in the semiconductor device manufacture.

Additionally, there is a possibility that the liquid is scatteredoutwardly when mixed in the air flow of the air curtain. Such liquid maycause damage of structural components of the exposure apparatus. If itoccurs actually, the operation of the exposure apparatus has to bestopped for repair or adjustment, and it results in a large decrease ofproductivity in the semiconductor device manufacture.

On the other hand, in the structure disclosed in PCT InternationalPublication WO99/49504, the amount of liquid supply and the amount ofliquid collection are adjusted in accordance with the moving speed ofthe substrate. However, since the motion of the substrate includesacceleration and deceleration, it is difficult to adjust the liquidsupplying rate and liquid collecting rate exactly at high precision inaccordance with the moving speed. If the liquid supplying rate andliquid collecting rate can not be adjusted at high precision, then it isdifficult to maintain the pressure inside the liquid constant. Thismeans that, with a change in pressure of the liquid, the liquid densitychanges and, as a result, the refractive index varies easily which inturn causes variation of the numerical aperture (NA) of the opticalsystem. This results in degradation of the exposure transfer precisionand, thus, a decrease of yield in the semiconductor device manufacture.

Furthermore, in the structure shown in FIG. 7 and in the structuredisclosed in PCT International Publication WO99/49504, there is a commonproblem that, since the position for liquid supply and collection isrestricted, the degree of freedom of the movement direction for thestepwise motion and scan motion is lowered. If the degree of freedom ofthe driving direction of the stepwise motion or scan motion is low, itleads to a decrease of the throughput and thus a decrease of theproductivity in the semiconductor device manufacture.

SUMMARY OF THE INVENTION

It is accordingly an object of the present invention to provide animproved liquid immersion type exposure apparatus.

It is another object of the present invention to provide an exposureapparatus by which mixture of bubbles into a liquid medium maintainedbetween a substrate to be exposed and an optical element of a projectionoptical system, nearest to the substrate, is prevented effectively andby which pressure variation of the liquid medium is held low, that isvariation of refractive index of the liquid medium is held low, suchthat a high resolution is assured.

Specifically, in accordance with an aspect of the present invention,there is provided an exposure apparatus, comprising: a projectionoptical system for projecting a pattern of a reticle onto a substrate,wherein the substrate is exposed through a liquid medium kept at leastin a portion between the substrate and an optical element of saidprojection optical system which optical element is nearest to thesubstrate; a supplying system for supplying a liquid medium; acollecting system for collecting a liquid medium; and an exhaustingsystem for removing a bubble in the liquid medium through a bubbleremoving material having such property that it passes a gas but it doesnot pass a liquid.

In accordance with another aspect of the present invention, there isprovided an exposure apparatus, comprising: a projection optical systemfor projecting a pattern of a reticle onto a substrate, wherein thesubstrate is exposed through a liquid medium kept at least in a portionbetween the substrate and an optical element of said projection opticalsystem which optical element is nearest to the substrate; a supplyingsystem for supplying a liquid medium; a collecting system for collectinga liquid medium; and an exhausting system for removing a bubble in theliquid medium through a porous material.

In accordance with a further aspect of the present invention, there isprovided an exposure apparatus, comprising: a projection optical systemfor projecting a pattern of a reticle onto a substrate, wherein thesubstrate is exposed through a liquid medium kept at least in a portionbetween the substrate and an optical element of said projection opticalsystem which optical element is nearest to the substrate; a supplyingsystem for supplying a liquid medium through a porous material; and acollecting system for collecting a liquid medium.

In accordance with a yet further aspect of the present invention, thereis provided a device manufacturing method, comprising the steps of:exposing a substrate by use of any one of the exposure apparatuses asrecited above; and developing the exposed substrate.

These and other objects, features and advantages of the presentinvention will become more apparent upon a consideration of thefollowing description of the preferred embodiments of the presentinvention taken in conjunction with the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic view of a structure of a liquid immersion typeexposure apparatus according to a first embodiment of the presentinvention.

FIG. 2 is a fragmentary view, showing a porous material and relatedcomponents in a liquid immersion type exposure apparatus according tothe first embodiment of the present invention.

FIG. 3 is a fragmentary view, showing a porous material and relatedcomponents in a liquid immersion type exposure apparatus according tothe first embodiment of the present invention.

FIG. 4 is a fragmentary view, showing a porous material and relatedcomponents in a liquid immersion type exposure apparatus according to asecond embodiment of the present invention.

FIG. 5 is a fragmentary view, showing a porous material and relatedcomponents in a liquid immersion type exposure apparatus according to athird embodiment of the present invention.

FIG. 6 is a fragmentary view, showing a porous material and relatedcomponents in a liquid immersion type exposure apparatus according to afourth embodiment of the present invention.

FIG. 7 is a schematic view for explaining a liquid immersion typeexposure apparatus of conventional structure.

FIG. 8 is a flow chart for explaining device manufacturing processes.

FIG. 9 is a flow chart for explaining a wafer process in the procedureof FIG. 8, in detail.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

Preferred embodiments of the present invention will now be describedwith reference to the attached drawings.

Embodiment 1

FIG. 1 is a schematic view showing a liquid immersion type exposureapparatus according to an embodiment of the present invention.

A substrate 1 that is an object onto which a circuit pattern or the likeis to be transferred, is held by a substrate holder 2 in accordance witha vacuum holding method or an electrostatic holding method. Thesubstrate holder 2 is mounted on a substrate stage 3 which is arrangedto perform stepwise motion or scan motion to follow a stage base table4. In the stepwise motion or scan motion, the substrate stage 3 iscontrolled on the basis of the result of measurement made through anautofocus (AF) sensor, not shown, so that the substrate 1 is held at apredetermined level (height).

On the other hand, the optical system includes a light source (notshown), an illumination system for illuminating a reticle having atransfer pattern with light from the light source, and a projectionoptical system mounted inside a barrel 5. The projection optical systemincludes an optical element (final optical element) which is nearest tothe substrate. A liquid medium 6 is as a feature of a liquid immersiontype exposure apparatus, held between the substrate 1 and the finaloptical element 6. The liquid medium 7 may be water or fluorinecompound, for example, and it may be chosen in accordance with the typeof a resist applied onto the substrate 1 or the wavelength of exposurelight, for example.

In this embodiment, a first porous material 8 and a second porousmaterial 9 are provided around the final optical element 6. The firstporous material 8 comprises a fine and continuous porosity structure,for example, which can be formed by extending (drawing)polytetrafluoroetylene (PTFE), for example, and which has such propertythat it passes gas but it does not pass liquid 7. The second porousmaterial 9 has such property that it absorbs liquid 7 on the basis ofcapillary phenomenon inside the porosity, like a sponge. A liquidsupplying system 10 supplies a liquid medium 7 through the second porousmaterial 9 to between the substrate 1 and the final optical element 6.The liquid supplying system 10 comprises a liquid supply source, aliquid supplying tube 10 a, and a liquid supplying nozzle 10 b at thetip end of the liquid supplying tube. The liquid supplying nozzle 10 bis connected to or approximately connected to the second porous material9. The whole second porous material 9 is operable to absorb liquid 7and, when the amount of absorption is saturated, it can supply theliquid. Therefore, the liquid 7 can be supplied from the whole surfaceof the porous material, being opposed to the substrate 1. Here, theamount of supply of the liquid 7 from the nozzle 10 b to the secondporous material 9 may preferably be controlled by a first controller(not shown) so as to maintain a state that the amount of liquid 7absorption of the second porous material 9 is continuously saturated.Any liquid 7 remaining on the substrate 1 as a result of stepwise motionor scan motion of the substrate stage 3 is collected by a liquidcollecting system 11. The liquid collecting system 11 comprises a liquidcollecting pump, a liquid collecting tube 11 a, and a liquid collectingnozzle 11 b at the tip end of the liquid collecting tube. The amount ofliquid collection is controlled by means of a second controller (notshown) so that it becomes substantially equal to the liquid supplyamount as controlled by the first controller. Although the liquidcollecting nozzle 11 b is disposed at the outer periphery of the secondporous material 9, the position thereof may be chosen arbitrarilyprovided that it is along the outer periphery of the final opticalelement 6. A vacuum evacuation system 12 is connected to the firstporous material 8, by which only bubbles within the liquid medium 7 canbe removed. Thus, with this arrangement, bubbles, if any, being mixedinto the supplied liquid medium 7 can be removed before they enter intobetween the substrate 1 and the final optical element 6.

Next, referring to FIG. 2, the structure around the porous material willbe explained. FIG. 2 illustrates the structure around the first porousmaterial 8 and the second porous material 9, in a liquid immersion typeexposure apparatus according to this embodiment of the presentinvention.

In FIG. 1, for simplicity of illustration of the apparatus structure,the first porous material 8 is disposed directly around the finaloptical element 6 and, additionally, the vacuum evacuation system 12 isdirectly connected to the first porous material 8. With this structure,however, only an ambience at the contact portion between the firstporous material 8 and the vacuum evacuation system 12 can be dischargedthrough the vacuum evacuation system 12, and therefore the function ofthe first porous material 8 for removing bubbles mixed into the liquidmedium 7 does not operate well. In consideration of it, aporous-material holding member 13 is provided additionally. Theporous-material holding member 13 has a space defined inside thereof,for accommodating the final optical element 6. Outside theporous-material holding member 13, the second porous material 9 can bemounted. The first porous material 8 is accommodated within theporous-material holding member 13. The face thereof to be opposed to thesubstrate 1 (bottom face as viewed in FIG. 2) is opened so that it canbe directly opposed to the first porous material 8. The porous-materialholding member 13 may be made of metal such as stainless steel oraluminum, for example, or glass. In FIG. 2, there is a clearance betweenthe top of the first porous material 8 and the porous-material holdingmember 13. Except this, preferably, no clearance should be defined atany other engagement surfaces. If there is a clearance between the topof the first porous material 8 and the porous-material holding member13, such clearance may preferably function as a buffer for vacuumevacuation. However, such clearance is not always necessary. The vacuumevacuation system 12 comprises a bubble evacuating tube 12 a connectedto an exhausting pump, for exhausting bubbles mixed in the liquid medium7, and a connector 12 b for connecting the bubble evacuation tube 12 awith the porous-material holding member 13. Thus, there is a clearancebetween the top of the porous material 8 and the babble evacuating tube12 a.

In FIG. 2, the liquid supplying system 10, the light collecting system11 and the vacuum evacuation system 12 are illustrated singly. However,the invention is not limited to this form, and the number of thesecomponents as well as positions of them can be chosen arbitrarily. As anexample, since the stepwise motion or scan motion of the substrate stage3 accompanies reciprocal motion of the substrate stage 3, taking it intoaccount, preferably there should be liquid supplying systems 10 andliquid collecting systems 11 mounted in opposite directions with respectto the stepwise movement direction or scan movement direction.

In FIGS. 1 and 2, two kinds of porous materials are disposed in an orderof first porous material 8 and second porous material 9, from the finaloptical element 6 side. However, the order may be reversed.Alternatively, plural layers may be provided in an alternate fashion.For example, as shown in FIG. 3, a first porous material 8 and a secondporous material 9 may be provided at the outer periphery of the finaloptical element 6. With this arrangement, any bubbles mixed into theliquid medium 7 can be removed by way of the first porous material 8,such that the liquid medium 7 can be supplied stably from the wholesurface of the second porous material 9. Namely, for the liquid supply,it is ensured that the liquid is supplied from a range as wide aspossible, and by doing so, the flow rate per unit area can be decreased.

As regards the first porous material 8, it is not limited to a porositymaterial provided that it has a property of passing a gas but notpassing liquid 7. Similarly, the second porous material 9 is not limitedto a porosity material provided that it has a property of absorbingliquid 7.

In FIGS. 1 and 2, the first porous material 8 and the second porousmaterial 9 are held at the same level (height) as the substrate-sideface of the final optical element 6. In FIG. 3, on the other hand, thesecond porous material 9 is held at the same level as the substrate-sideface of the final optical element 6. The clearance between the substrate1 and the final optical element 6 is in a range of tens microns tomillimeter order. As shown in Figures 1-3, the first porous material 8and/or the second porous material 9 should desirably be held at the samelevel as the substrate-side face of the final optical element 6.However, this is not a requisition. The clearance between the substrate1 and the first porous material 8 or second porous material 9 may bechosen arbitrarily.

The first porous material 8 or the porous-material holding member 13 aswell as the second porous material 9 are illustrated as having aconcentric shape as of the final optical element 6. However, this is nota requisition, and any shape such as a square shape may be chosenarbitrarily.

Although it is preferable that the first porous material 8 and thesecond porous material 9 are each provided along the entirecircumference of the final optical element 6, only it is necessary thatthey are provided at least in a portion of the circumference of thefinal optical element 6, along the stepwise direction or scan direction.Also, the size of the first and second porous materials 8 and 9 is notlimited to such proportion, with respect to the size of the finaloptical element 6, as illustrated in the drawing. It may be chosenarbitrarily. Furthermore, while an example wherein the porous-materialholding member 13 covers only the first porous material 8, the inventionis not limited to this. It may be arranged to cover the second porousmaterial 9 as well.

Embodiment 2

FIG. 4 illustrates the structure around first to third porous materialsin a liquid immersion type exposure apparatus according to anotherembodiment of the present invention.

In the first embodiment, a residual liquid medium 7 left on thesubstrate 1 is directly collected by the liquid collecting system 11. Inthis embodiment, on the other hand, a third porous material (liquidcollecting material) 14 is provided additionally, so that a liquid 17 iscollected through the third porous material 14. Description of similarstructure and function of this embodiment, like those of the firstembodiment, will be omitted to avoid duplication.

The third porous material 14 may have such property that it holds aliquid medium 7 on the basis of capillary phenomenon inside theporosity, like a sponge, and a similar porosity material as of thesecond porous member may be used. The liquid collecting system 11 isconnected or approximately connected to the third porous material 14.The third porous material is normally used in a state that no liquid 7is absorbed thereby, that is, it is being dry, and it functions toremove any liquid medium 7 remaining on the substrate 1. As regards theamount of liquid correction here, preferably it is controlled by asecond controller (not shown) to ensure that the amount of absorption ofliquid 7 by the third porous material 14 is not saturated, thereby tokeep its liquid absorbing capacity continuously. Here, if the secondporous material 9 having absorbed the liquid 7 sufficiently and thethird porous material 14 not having absorbed the liquid 7 are disposedin juxtaposition, it is possible that the liquid medium 7 absorbed bythe second porous material 7 is directly absorbed by the third porousmaterial 14, degrading the function of the third porous material 14 forremoval of residual liquid 7 on the substrate 1. In consideration of it,there should be a wall between the second porous material 7 and thethird porous material 14, although it is not illustrated in FIG. 4.

As regards the method of collecting liquid 7, in the foregoingdescription, the liquid is once absorbed by the third porous material 14and then is collected by the liquid collecting system 11. However, theinvention is not limited to this. For example, the liquid collectingsystem 11 may be omitted if the third porous material 14 can absorb asufficient amount of liquid 7. In that occasion, after it absorbs apredetermined amount of liquid 7 or after completion of exposures ofsubstrates of a predetermined number, the porous material may bereplaced by fresh one or one having been dried. In this case, suitablereplacing means for replacing the third porous material by another isnecessary.

As has been described with reference to the first embodiment, theclearance between the substrate 1 and the final optical element 6 is ina range from tens microns to millimeter order. Similarly to the firstporous material 8 and the second porous material 9, it is desirable thatthe third porous material is held at the same level as thesubstrate-side face of the final optical element 6. However, it is not arequisition, and the clearance between the substrate and the first,second or third porous material 8, 9 or 14 may be chosen arbitrarily.Furthermore, like the first porous material 8 or the porous-materialholding member 13 as well as the second porous material 9, the thirdporous material 14 is illustrated as having a concentric shape as of thefinal optical element 6. However, this is not a requisition, and anyshape such as a square shape may be chosen arbitrarily.

Although it is preferable that the first porous material 8, the secondporous material 9 and the third porous material 14 are each providedalong the entire circumference of the final optical element 6, only itis necessary that they are provided at least in a portion of thecircumference of the final optical element 6, along the stepwisedirection or scan direction. Also, the size of the first, second andthird porous materials 8, 9 and 14 is not limited to such proportion,with respect to the size of the final optical element 6, as illustratedin the drawing. It may be chosen arbitrarily. Furthermore, while anexample wherein the porous-material holding member 13 covers only thefirst porous material 8, the invention is not limited to this. It may bearranged to cover the second porous material 9 or the third porousmaterial 14 as well.

The first porous material is not limited to a porosity material providedthat it has a property for absorbing liquid 7.

Embodiment 3

FIG. 5 illustrates the structure around a first porous material in aliquid immersion type exposure apparatus according to a furtherembodiment of the present invention.

The first and second embodiments have been described with reference toexamples wherein a plurality of porous materials are used to performliquid supply, liquid collection and removal of bubbles mixed in theliquid 7. In the third embodiment, a first porous material 8 is used asthe porosity member and, by using nozzles mounted around it, liquid issupplied and collected. Description of similar structure and function ofthis embodiment, like those of the first or second embodiment, will beomitted to avoid duplication.

The first porous material 8 is hold within a porous-material holdingmember 13. Outside the porous-material holding member 13, there is avacuum evacuation system 12 so that any bubbles mixed into the liquid 17can be removed through the vacuum evacuation system 12. Also mounted atthe outside periphery of the porous-material holding member 13 are aliquid supplying system 10 and a liquid collecting system 11. The liquidsupplying system 10 supplies a liquid medium 7 to between the substrate1 and the final optical element 6, and the liquid collecting system 11collect the liquid 7. The structure for collecting any residual liquid 7left on the substrate 1 is not limited to direct collection using theliquid collecting system 11. As described with reference to the secondembodiment, a third porous material 14, not shown in FIG. 5, may bemounted around the porous-material holding member 13.

Embodiment 4

FIG. 6 illustrates the structure around a second porous material in aliquid immersion type exposure apparatus according to a fourthembodiment of the present invention.

The first and second embodiments have been described with reference toexamples wherein a plurality of porous materials are used to performliquid supply, liquid collection and removal of bubbles mixed in theliquid 7. In the forth embodiment, a second porous material 9 is used asthe porosity member, and through the second porous material 9, theliquid is collected. The liquid is collected by using a nozzle mountedaround it. Description of similar structure and function of thisembodiment, like those of the first or second embodiment, will beomitted to avoid duplication.

The structure for collecting any residual liquid 7 left on the substrate1 is not limited to direct collection using the liquid collecting system11. As described with reference to the second embodiment, a third porousmaterial 14, not shown in FIG. 6, may be mounted around theporous-material holding member 13.

In accordance with some preferred embodiments of the present inventionas described hereinbefore, in a liquid immersion type exposureapparatus, a liquid medium can be held between a substrate and a finaloptical element assuredly. As a result, there is no necessity of usingan air curtain and, second, there is no possibility that, due to the aircurtain, bubbles are mixed into the liquid medium between the substrateand the final optical element. Furthermore, because of the provision ofporous material member, the meniscus produced at the boundary betweenthe liquid medium and the outside ambience is separated away from thefinal optical element. Therefore, even if the meniscus is broken,bubbles are not mixed into the liquid between the substrate and thefinal optical element. As a result, degradation of the exposure transferprecision owing to the bubbles within the liquid can be avoided.Moreover, since the liquid supplying and/or collecting method withoutusing an air curtain just applies only a required flow rate from theporous material, pressure variation can be well suppressed and, thus,the liquid density does not change. Therefore, any change in therefractive index of the liquid medium can be well suppressed and, inturn, a change in the numerical aperture (NA) of the optical system canbe avoided. Consequently, degradation of the exposure transfer precisiondue to variation in NA of the optical system can be prevented.Additionally, since the structure is such that liquid supply and liquidcollection are made while surrounding the exposure region, the degree offreedom for the stepwise motion or scan motion is enlarged and,therefore, the throughput can be improved. Moreover, since any residualliquid adhered to the substrate can be collected without being scatteredinto the projection exposure apparatus, damage of any structuralcomponents due to the scattered liquid can be prevented and unwantedinterruption of the operation of the apparatus, due to it, can beavoided. Thus, a liquid immersion type exposure apparatus by which theproductivity in semiconductor device manufacture can be improved, isaccomplished.

Embodiment 5

Next, referring to FIGS. 8 and 9, an embodiment of a devicemanufacturing method which uses an exposure apparatus according to anyone of the embodiments described above, will be explained.

FIG. 8 is a flow chart for explaining the procedure of manufacturingvarious microdevices such as semiconductor chips (e.g., ICs or LSIs),liquid crystal panels, or CCDs, for example. Step 1 is a design processfor designing a circuit of a semiconductor device. Step 2 is a processfor making a mask on the basis of the circuit pattern design. Step 3 isa process for preparing a wafer by using a material such as silicon.Step 4 is a wafer process which is called a pre-process wherein, byusing the thus prepared mask and wafer, a circuit is formed on the waferin practice, in accordance with lithography. Step 5 subsequent to thisis an assembling step which is called a post-process wherein the waferhaving been processed at step 4 is formed into semiconductor chips. Thisstep includes an assembling (dicing and bonding) process and a packaging(chip sealing) process. Step 6 is an inspection step wherein anoperation check, a durability check an so on, for the semiconductordevices produced by step 5, are carried out. With these processes,semiconductor devices are produced, and they are shipped (step 7).

FIG. 9 is a flow chart for explaining details of the wafer process. Step11 is an oxidation process for oxidizing the surface of a wafer. Step 12is a CVD process for forming an insulating film on the wafer surface.Step 13 is an electrode forming process for forming electrodes upon thewafer by vapor deposition. Step 14 is an ion implanting process forimplanting ions to the wafer. Step 15 is a resist process for applying aresist (photosensitive material) to the wafer. Step 16 is an exposureprocess for printing, by exposure, the circuit pattern of the mask onthe wafer through the exposure apparatus described above. Step 17 is adeveloping process for developing the exposed wafer. Step 18 is anetching process for removing portions other than the developed resistimage. Step 19 is a resist separation process for separating the resistmaterial remaining on the wafer after being subjected to the etchingprocess. By repeating these processes, circuit patterns are superposedlyformed on the wafer.

With these processes, high density microdevices can be manufactured.

While the invention has been described with reference to the structuresdisclosed herein, it is not confined to the details set forth and thisapplication is intended to cover such modifications or changes as maycome within the purposes of the improvements or the scope of thefollowing claims.

This application claims priority from Japanese Patent Application No.2003-312635 filed Sep. 4, 2003, for which is hereby incorporated byreference.

1. An exposure apparatus, comprising: a projection optical system forprojecting a pattern of a reticle onto a substrate, wherein thesubstrate is exposed through a liquid medium kept at least in a portionbetween the substrate and an optical element of said projection opticalsystem which optical element is nearest to the substrate; a supplyingsystem for supplying a liquid medium; a collecting system for collectinga liquid medium; and an exhausting system for removing a bubble in theliquid medium between the substrate and said optical element through aporous material.
 2. An apparatus according to claim 1, wherein saidsupplying system and said exhausting system have a nozzle, and whereinthe nozzle of said exhausting system is disposed at a side of the nozzleof said supplying system which side faces said optical element.
 3. Anapparatus according to claim 1, wherein said supplying system and saidcollecting system have a nozzle, and wherein the nozzle of saidcollecting system is disposed at a side of the nozzle of said supplyingsystem which side faces said optical element.
 4. An apparatus accordingto claim 1, wherein said supplying system supplies the liquid through aporous material.
 5. An apparatus according to claim 1, wherein saidcollecting system collects the liquid medium through a porous material.6. An apparatus according to claim 4, wherein the porous material ofsaid supplying system has a property different from that of the porousmaterial of said exhausting system.
 7. An apparatus according to claim5, wherein the porous material of said collecting system has a propertydifferent from that of the porous material of said exhausting system. 8.An exposure apparatus, comprising: a projection optical system forprojecting a pattern of a reticle onto a substrate, wherein thesubstrate is exposed through a liquid medium kept at least in a portionbetween the substrate and an optical element of said projection opticalsystem which optical element is nearest to the substrate; a supplyingsystem for supplying a liquid medium through a first porous material;and a collecting system for collecting a liquid medium through a secondporous material, wherein a surface of said first porous materialdisposed opposed to the substrate and a surface of said second porousmaterial disposed opposed to the substrate are maintained at the samelevel with respect to the substrate.
 9. An apparatus according to claim8, wherein the surfaces of said first and second porous materials areparallel to a surface of said optical element opposed to the substrate.10. An apparatus according to claim 8, wherein the surfaces of saidfirst and second porous materials and the surface of said opticalelement opposed to the substrate are maintained at the same level withrespect to the substrate.
 11. An exposure apparatus, comprising: aprojection optical system for projecting a pattern of a reticle onto asubstrate, wherein the substrate is exposed through a liquid medium keptat least in a portion between the substrate and an optical element ofsaid projection optical system which optical element is nearest to thesubstrate; and a collecting system for collecting a fluid through aporous material, said collecting system including a holding member forholding the porous material; wherein a surface of the porous materialdisposed opposed to the substrate and a surface of said holding memberare maintained at the same level with respect to the substrate.
 12. Anapparatus according to claim 11, wherein said collecting system collectsa bubble in the liquid medium between the substrate and the opticalelement through the porous material.
 13. A device manufacturing method,comprising the steps of: exposing a substrate by use of an exposureapparatus as recited in claim 1; and developing the exposed substrate.14. A device manufacturing method, comprising the steps of: exposing asubstrate by use of an exposure apparatus as recited in claim 8; anddeveloping the exposed substrate.
 15. A device manufacturing method,comprising the steps of: exposing a substrate by use of an exposureapparatus as recited in claim 11; and developing the exposed substrate.